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| BUZ 305 SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 305 VDS 800 V ID 7.5 A RDS(on) 1 Package TO-218 AA Ordering Code C67078-S3134-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 7.5 Unit A ID IDpuls 30 TC = 31 C Pulsed drain current TC = 25 C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 7.5 16 mJ ID = 7.5 A, VDD = 50 V, RGS = 25 L = 27.7 mH, Tj = 25 C Gate source voltage Power dissipation 830 VGS Ptot 20 150 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 0.83 75 E 55 / 150 / 56 C K/W 1 01/97 BUZ 305 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 800 3 0.1 10 10 0.85 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 A VDS = 800 V, VGS = 0 V, Tj = 25 C VDS = 800 V, VGS = 0 V, Tj = 125 C Gate-source leakage current IGSS 100 nA 1 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 5 A Semiconductor Group 2 01/97 BUZ 305 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 2.5 7.5 2000 220 130 - S pF 2650 330 200 ns 30 45 VDS 2 * ID * RDS(on)max, ID = 5 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 2.7 A RGS = 50 Rise time tr 120 180 VDD = 30 V, VGS = 10 V, ID = 2.7 A RGS = 50 Turn-off delay time td(off) 500 670 VDD = 30 V, VGS = 10 V, ID = 2.7 A RGS = 50 Fall time tf 150 200 VDD = 30 V, VGS = 10 V, ID = 2.7 A RGS = 50 Semiconductor Group 3 01/97 BUZ 305 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 0.95 750 15 7.5 30 V 1.4 ns C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 15 A Reverse recovery time VR = 100 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 100 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 01/97 BUZ 305 Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 8.0 160 W A Ptot ID 120 6.0 100 5.0 80 4.0 60 3.0 40 2.0 20 0 0 1.0 0.0 20 40 60 80 100 120 C 160 0 20 40 60 80 100 120 C 160 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 2 Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 0 A t = 1000.0ns p 10 s K/W ID 10 1 ZthJC 10 -1 100 s DS /I D =V 1 ms DS (on ) D = 0.50 10 ms 0.20 10 -2 10 0 R 0.10 0.05 single pulse 0.02 0.01 DC 10 -1 10 0 10 1 10 2 V 10 3 10 -3 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 01/97 BUZ 305 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 17 A l Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C 3.2 Ptot = 150W kj ihg f e VGS [V] 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0 a b c da b ID 14 12 10 RDS (on) 2.4 c d c e f g 2.0 8 6 1.6 d h i j k 1.2 4 2 0 0 bl 0.8 0.4 VGS [V] = a 4.5 4.0 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 e f hg ji k a h i j k 8.0 9.0 10.0 20.0 0.0 5 10 15 20 25 30 35 V 45 0 2 4 6 8 10 12 A 16 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 13 A 11 parameter: tp = 80 s, VDS2 x ID x RDS(on)max 15 S 13 ID 10 9 gfs 12 11 10 8 7 6 5 4 3 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 V VGS 10 2 1 0 0 2 4 6 8 A ID 12 Semiconductor Group 6 01/97 BUZ 305 Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 5 A, VGS = 10 V 5.0 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 RDS (on) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -60 98% VGS(th) 3.6 3.2 2.8 2.4 2.0 typ 2% 98% typ 1.6 1.2 0.8 0.4 0.0 -60 -20 20 60 100 C 160 -20 20 60 100 C 160 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 5 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 2 pF C 10 4 A IF 10 1 Ciss 10 3 10 0 Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Coss 10 2 0 5 10 15 20 25 30 Tj = 150 C (98%) 10 -1 0.0 Crss V 40 VDS 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 01/97 BUZ 305 Avalanche energy EAS = (Tj ) parameter: ID = 7.5 A, VDD = 50 V RGS = 25 , L = 27.7 mH 900 mJ Typ. gate charge VGS = (QGate) parameter: ID puls = 11 A 16 V EAS 700 600 VGS 12 10 500 8 400 6 300 200 100 0 20 4 0,2 VDS max 0,8 VDS max 2 0 40 60 80 100 120 C 160 0 40 80 120 160 200 nC 260 Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 960 V 920 V(BR)DSS 900 880 860 840 820 800 780 760 740 720 -60 -20 20 60 100 C 160 Tj Semiconductor Group 8 01/97 |
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